What is laser marking?
Laser marking (laser marking machine) uses a laser beam to make permanent marks on the surface of various materials. The effect of marking is to expose deep material through the evaporation of surface material, thereby engraving exquisite patterns, trademarks and characters.
How many types of laser marking machine
Laser marking machines are more and more widely used in industrial laser processing.
In order to meet different requirements, different types of laser marking machine models have been produced.
With different laser source for different materials.
There are Fiber Laser marking machine,
Mopa Laser Marking Machine,
CO2 Laser marking Machine,
UV Laser Marking Machine.
To meet specially marking,
there are 3D Dynamic laser marking machine,
Flying Laser marking machine
CCD visual auto positioning laser marking machine.
Applications of Laser marking machine?
Can mark a variety of non-metallic materials. Used in clothing accessories, pharmaceutical packaging, wine packaging, architectural ceramics, beverage packaging, fabric cutting, rubber products, shell nameplates, craft gifts, electronic components, leather and other industries.
1. Can engrave metal and a variety of non-metal materials. It is more suitable for the processing of some products that require fine and high precision.
2. Used in electronic components, integrated circuits (IC), electrical appliances, mobile communications, hardware products, tool accessories, precision equipment, glasses and watches, jewelry, auto parts, plastic buttons, building materials, PVC pipes, medical equipment and other industries .
3. Applicable materials include: common metals and alloys (iron, copper, aluminum, magnesium, zinc and other metals), rare metals and alloys (gold, silver, titanium), metal oxides (all kinds of metal oxides are acceptable), Special surface treatment (phosphating, aluminum anodization, electroplating surface), ABS material (electric appliance shell, daily necessities), ink (transparent keys, printed products), epoxy resin (electronic component packaging, insulating layer).
